P-Type Boron-Doped 200nm Sio2 Thermal Oxide Wafer – Best Quality

We give warm oxide wafer in measurement from 2" to 12 " , we generally pick prime evaluation and imperfection free P-type Boron- doped 200nm SiO2 thermal oxide wafer as substrate for developing high consistency warm oxide layer to meet your particular necessities . Reach us for additional data on cost and conveyance time.

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Diced silicon wafer with a dry oxide coating have been used luxuriously in microelectronics and MEMS as a phase for produce. An entrancing assortment of the standard Diced silicon wafer with a dry oxide covering is the SOI substrate.

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