Silicon wafers have been utilized richly in microelectronics and MEMS as a stage for manufacture. A fascinating variety of the standard Diced silicon wafer with a dry oxide coating is the SOI substrate. To deliver these wafers, two silicon wafers are reinforced together, utilizing silicon dioxide of around 1–2 µm thickness as a bond layer. One of the silicon wafers is weakened to a thickness of 10–50 µm.
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