SiO2 Thermal Oxide Wafer is Used for MEMS Devices and Systems!

Silicon is known as the second most available material in the universe. And this is now used in a great amount of make the semiconductors. These items are used for the making of different electronic devices that we use these days to make life simple and convenient. So, you can say that the electronic industry also depends greatly on the production of the silicon thermal oxide wafer. Silicon wafers are something that we have at least seen once in our lifetime. These materials are quite common. The computer you use or the mobile phone that you carry to communicate with others is also made while using the semiconductors. So, it’s the semiconductor technology that is followed now greatly depends on the silicon wafer. These are the thin layers are they are primarily used as the dielectric material. These wafers are also integrated for the MEMS or the micro electro mechanical systems. In order to produce the silicon thermal oxide wafer, the oxidation of the silicon with oxygen needs to be done.

SiO2 Fused Silica Wafer

• Thermal oxidation process is followed

The thermal oxidation process followed can expose the silicon wafer to the oxidizing agents as well as heat. Due to this process, a silicon dioxide layer is also formed. This type of layer comprises of oxygen and hydrogen. Sometime halogen gas is also used to make the SiO2 thermal oxide wafer.

• Used as the dielectric material

During this oxidation process, heat source is also used to catalyze the reaction as well as to create the layers of oxide. The applications of these silicon wafers can be many. But mainly they are used as the dielectric material.